Wednesday, August 10, 2011

Electronics Kit Build Help?

My strategy is to limit how hot the ICs get. I will solder one IC pin, and then go to a different part of the board and solder a pin of a different IC, or a resistor or whatever. Later I return to the first IC and solder another pin, etc. I do this to allow time for the IC to cool down between applications of the soldering iron. Perhaps this is overkill but that's the way I do it. Also on DIP ICs, I prefer to start near the middle of the row of pins and work out to the ends. It makes is easier to avoid solder bridge errors.

No comments:

Post a Comment